http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113416389-A

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filingDate 2021-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1af1f3cb0f97331f1d3d71b99a8bca24
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publicationDate 2021-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-113416389-A
titleOfInvention Ultra-high isotropic thermally conductive material of epoxy-based two-dimensional sheet metal nanofiller and preparation method thereof
abstract The invention provides an ultra-high isotropic thermal conductive material of epoxy-based two-dimensional sheet metal nano-filler and a preparation method thereof. The components of the material mainly include epoxy resin, two-dimensional sheet-shaped metal nano-filler, two-dimensional sheet The carbon-based thermally conductive filler and the diluent are prepared by uniformly mixing the above components, removing the diluent, and then preparing the thermally conductive material or product through a hot-pressing molding process. In the present invention, two two-dimensional sheet-like thermally conductive fillers are overlapped in an epoxy resin matrix to form a three-dimensional thermally conductive network, thereby realizing the efficient overlap and efficient synergistic effect of the two-dimensional sheet-like metal nano-fillers, and greatly improving the obtained thermally conductive materials or parts. thermal conductivity, and has the characteristics of isotropic thermal conductivity.
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