| abstract |
The invention discloses a modified epoxy acrylic resin conductive adhesive, which comprises the following components based on 100 parts by total mass: including the following raw material components: 30.0-90.0 parts of conductive particles, modified epoxy propylene 18.0-45.0 parts of ester resin, 0.5-2.5 parts of silane coupling agent, and 0.5-3.0 parts of initiator; wherein, the conductive particles include conductive particles with three-dimensional dendritic microstructure; the invention also discloses the conductive adhesive. Preparation method and application. The conductive adhesive of the invention has the characteristics of good conductivity, short curing time, high adhesion, and can be operated and used for a long time at room temperature. |