| abstract |
The present invention provides a curable silicone composition and its use. When the curable silicone composition is transfer molded, the molded cured product has a low modulus and is soft even at high temperature, and has excellent stress relaxation properties. When integrally molded with a base material, warping and defects of the molded product are less likely to occur, and the cured product after transfer molding has excellent mold release properties (mold release). A curable silicone composition for transfer molding and use thereof, in terms of the curable silicone composition for transfer molding, measured by MDR (Moving Die Rheometer) at a molding temperature from room temperature to 200°C, (1) The maximum torque value is less than 50dN·m, and (2) when the maximum torque value is reached, the value of the loss tangent (tanδ) expressed by the ratio of the stored torque value/loss torque value is less than 0.2. |