http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113395837-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-173 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-03 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate | 2021-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113395837-B |
| titleOfInvention | A Wet Laser Forming Method for Nano Metal Circuits and Structures |
| abstract | The present invention relates to the technical field of integrated circuits, more specifically, to a method for wet laser forming of nanometer metal circuits and structures, comprising the following steps: S1. Presetting circuits on a carrier to form a carrier to be formed, and then The surface of the circuit to be formed carrier is coated with nano-metal paste in a wet state; S2. The surface of the nano-metal paste on the circuit to be formed is modified to form a pre-sintered neck; The surface of the nano-metal paste on the circuit to be formed carrier is irradiated at least once, and the circuit is sintered to obtain a circuit-shaped carrier; S3. Clean the circuit-shaped carrier; S4. Clean the circuit-shaped carrier. Surface treatment to obtain circuit carrier board. The invention can control the shape of the circuit, optimize the quality of the circuit, and improve the forming efficiency of the circuit. |
| priorityDate | 2021-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.