http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113388350-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 |
| filingDate | 2021-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113388350-B |
| titleOfInvention | Heating repairable epoxy structural adhesive and preparation method thereof |
| abstract | The invention relates to a heatable reworkable epoxy structure adhesive and its application, which is characterized by comprising DA structure epoxy resin, liquid epoxy resin, latent curing agent, DA structure amine curing agent, stabilizer, inorganic filler, silane The coupling agent and the expanded graphite powder are mixed and stirred evenly at a temperature of 10-35° C. to obtain an epoxy structure adhesive that can be heated and repaired, wherein the DA structure epoxy resin, liquid epoxy resin, latent curing agent, DA structure The mass ratio of amine curing agent, stabilizer, inorganic filler, silane coupling agent and expanded graphite powder is 1:0.1‑1:0.05‑0.2:0‑0.2:0.001‑0.005:0.5‑3:0.001‑0.1:0.001 ‑0.005. It can be decomposed by heating, and can be used for device adhesive or chip underfill in smartphones or smart vehicles, which can achieve good bonding and underfilling effects, and has good rework characteristics. |
| priorityDate | 2021-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 81.