| abstract |
Electrodeposition of cobalt or copper alloys and their use in microelectronics. The present invention relates to methods of making cobalt or copper interconnects, and electrolytes capable of carrying out said methods. Electrolytes with a pH of less than 4.0 contain cobalt or copper ions, chloride ions, manganese ions or zinc ions and up to two low molecular weight organic additives. One of these additives can be an alpha-hydroxycarboxylic acid. |