http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113371673-A

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filingDate 2021-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_661370e8898bdf04b980e3fc2188a653
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publicationDate 2021-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-113371673-A
titleOfInvention A hybrid integrated sensing microsystem and its single-chip integrated fabrication method
abstract The invention discloses a hybrid integrated sensing micro-system and a single-chip integrated preparation method thereof. The components of the hybrid integrated sensing micro-system include a multi-channel micro-sensor, a micro-sensor signal conditioning circuit, a micro-control unit, a radio frequency circuit module, a peripheral Servo circuits such as equipment and support circuits, all the components are integrated and prepared by bulk silicon process or SOI process, micro-sensors, analog CMOS circuits and digital CMOS circuits are integrated on a single chip, or some components are integrated on a single chip, and then System-level integration with remaining components. The single-chip integrated fabrication method of the integrated sensing microsystem is based on a partially depleted SOI CMOS process, and uses the partially depleted SOI CMOS process to complete most of the micro-sensor plane processing steps, and after the SOICMOS preparation process is completed, the remaining steps are completed. Processing steps for microsensors. The integrated sensing micro-system of the invention has the technical advantages of multi-channel signal parallel detection, long-distance signal transmission, high signal-to-noise ratio, low cost, small size, low power consumption, easy portability and the like.
priorityDate 2021-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 25.