| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_98f92c496e4f5c70f34681fb4bf526d2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B2201-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-189
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0127
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0271 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0292
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0077
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4605 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L41-083 |
| filingDate |
2020-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fca759faaaf0e67dc3443e9087bed922
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62b794526f4f4dadb8732afcd0841e2e |
| publicationDate |
2021-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-113366926-A |
| titleOfInvention |
Package structure and package method for on-chip ultrasound device |
| abstract |
A method of forming a multi-layer hybrid interposer structure is disclosed, the method comprising forming a plurality of first openings through a substrate, the substrate including a heat transfer material; within the plurality of first openings and a top surface of the substrate and forming a first metal material on the bottom surface; patterning the first metal material; forming a dielectric layer on the patterned first metal material; forming a plurality of second openings in the dielectric layer to expose the substrate portions of the patterned first metallic material on the top and bottom surfaces; filling the plurality of second openings with a second metallic material in contact with the exposed portions of the patterned first metallic material; in A third metal material is formed on top and bottom surfaces of the substrate, the third metal material is in contact with the second metal material and the dielectric layer; and the third metal material is patterned. |
| priorityDate |
2019-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |