abstract |
The present invention provides a curable granular silicone composition, etc., which has hot-melt properties, and has particularly high flexibility and toughness at high temperatures from room temperature to about 150°C in cured products such as secondary molding. Excellent, even if it is integrally molded with an aluminum lead frame, etc., it provides a cured product that is less likely to warp or break. A curable granular silicone composition and its application, the curable granular silicone composition is characterized in that it contains: (A) polyorganosiloxane resin particles with curing reactive functional groups, (B) functional inorganic The filler and (C) curing agent are cured to provide the following cured product: the storage modulus at 25°C and 150°C is 2000MPa or less and 100MPa or less, respectively, from the storage modulus/loss modulus (G'/G") The indicated peak value of tan δ is 0.40 or more. |