| abstract |
The present invention provides a curable granular silicone composition, etc., which has a hot-melt property, and has a particularly high flexibility and toughness at high temperatures ranging from room temperature to about 150° C. of cured products such as secondary molding. It is excellent, and even if it is integrally molded with an aluminum lead frame or the like, it provides a cured product that does not easily cause warpage and breakage. A curable granular silicone composition and its use, the curable granular silicone composition comprising: (A) polyorganosiloxane resin fine particles having a curing-reactive functional group, (B) functional inorganic The filler and the (C) curing agent provide the following cured product by curing: the storage modulus at 25°C and 150°C is 2000 MPa or less and 100 MPa or less, respectively, by storage modulus/loss modulus (G'/G") The peak value of the indicated tanδ is 0.40 or more. |