http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113293362-B

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0793
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1824
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-38
filingDate 2021-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2022-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-113293362-B
titleOfInvention Chemical copper plating bulking solution and preparation method and application thereof
abstract The invention provides a chemical copper plating swelling solution and a preparation method and application thereof, belonging to the technical field of swelling solutions. The chemical copper plating bulking liquid is prepared from raw materials including an alcohol compound, an alcohol ether compound, a crown ether compound, a dispersing agent, an alkaline regulator, an organic phosphonic acid compound and water, wherein the concentration of the alcohol compound is 1-100 mL/L, the concentration of the alcohol ether compound is 1-100 mL/L, the concentration of the crown ether compound is 1-100 g/L, the concentration of the dispersing agent is 1-100 g/L, the concentration of the alkaline regulator is 0.1-100 g/L, and the concentration of the organic phosphonic acid compound is 1-100 g/L; the alkaline regulator comprises sodium hydroxide and/or potassium hydroxide. The chemical copper plating bulking liquid provided by the invention has the advantages of good stability, high tolerance to carbonate, good permeability and good degumming effect on high-frequency and high-speed base materials, and can prolong the service life of the bath solution and reduce the discharge of waste water.
priorityDate 2021-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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