| abstract |
An object of the present invention is to provide a resin composition that has excellent embedment properties, can suppress warpage during curing, and can obtain a cured product excellent in mechanical strength. The solution of the present invention is a resin composition comprising (A) an epoxy resin, (B) an inorganic filler, (C) a curing agent, and (D) a non-epoxy compound containing a polyether skeleton. A composition in which the polyether skeleton contained in the component (D) is a polyoxyalkylene skeleton composed of at least one monomeric unit selected from ethylene oxide units and propylene oxide units, and is added to the resin composition. When the total nonvolatile content of the resin composition is 100% by mass, the content of the (B) component is 70% by mass or more, and when the nonvolatile content other than the (B) component in the resin composition is 100% by mass, (D) Content of a component is 1 mass % or more and 30 mass % or less. |