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filingDate 2019-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9814743b2e923c6b409ce119447f8de4
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publicationDate 2021-08-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-113261391-A
titleOfInvention Wiring substrate, method for manufacturing same, and method for manufacturing highly conductive wiring substrate
abstract Provided is a wiring substrate wherein disconnection at a bent portion is suppressed and wherein the bent portion has excellent conductivity. The wiring substrate comprises wiring and a base material having electrodes on both surfaces, wherein the wiring connects the electrodes on both surfaces of the base material and a part of the wiring is arranged at an end of the base material, the wiring contains an organic material and conductive particles, and the content of the conductive particles in the wiring is 60-90% by mass.
priorityDate 2019-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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