http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113241375-B

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0642
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0649
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0603
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0607
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-78654
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66477
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66772
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-42356
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-06
filingDate 2021-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2022-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-113241375-B
titleOfInvention Semiconductor device and method of manufacturing the same
abstract The present invention provides a semiconductor device and a manufacturing method thereof. The semiconductor device comprises: an SOI substrate, including a bottom-up lower substrate, an insulating buried layer and a semiconductor layer, wherein a device active region is formed in the semiconductor layer , a trench isolation structure is formed around the periphery of the active region of the device; a gate layer is formed on the semiconductor layer, and the gate layer extends from the active region of the device to the trench isolation structure and, a source region and a drain region, respectively formed in the active region of the device on both sides of the gate layer, at least one end of the gate layer spanning the active region of the device and the trench The portion at the interface of the trench isolation structure extends toward the source region and/or the drain region. The technical solution of the present invention reduces edge leakage at the interface between the active region of the device and the trench isolation structure, thereby improving the performance of the semiconductor device.
priorityDate 2021-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419593443
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID518712

Total number of triples: 23.