http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113231958-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-005 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-10 |
| filingDate | 2021-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113231958-B |
| titleOfInvention | Chemical mechanical polishing method of non-mechanical contact type magnetic in-situ ultrasonic vibration |
| abstract | The invention relates to the technical field of semiconductor processing, in particular to a chemical mechanical polishing method of non-mechanical contact type magnetic in-situ ultrasonic vibration. The invention adopts the chemical mechanical polishing solution containing ferromagnetic particles, and the upper side and the lower side of the surface to be polished of the base material are respectively provided with periodic alternating magnetic fields covering the region of the polished surface, and the periodic alternating magnetic fields act on the ferromagnetic particles in the polishing solution in a non-contact electromagnetic induction mode to enable the ferromagnetic particles to generate high-frequency vibration and simultaneously drive the abrasive in the polishing solution to act on the polished surface. The invention solves the technical problems of the traditional mechanical contact type ultrasonic vibration auxiliary chemical mechanical polishing method, such as the fact that ultrasonic vibration needs to be conducted to a polishing surface through mechanical contact, the structure is complex, the vibration conduction efficiency is low, and the mechanical structure vibration mode matching needs to be carried out. |
| priorityDate | 2021-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.