http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113227252-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ca4a4e36e37395a0133b2c18f5c533b5 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2650-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2650-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2650-04 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-126 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-10 |
| filingDate | 2019-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e13fe8a900c502f089682686f12de1ff http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_303243576996e5855fde7b49429fb6f8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b67b61a54f68c2ad6f026ff66f960fea |
| publicationDate | 2021-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113227252-A |
| titleOfInvention | High heat-resistant thermoplastic resin composition and molded product thereof |
| abstract | The present invention provides a thermoplastic resin composition which is excellent in heat resistance, mechanical properties, and adhesiveness with a reinforcing fiber base material as a dissimilar material, and in particular, which can obtain a molded product having excellent rigidity at high temperature. A thermoplastic resin composition and a molded product thereof, the thermoplastic resin composition comprising a phenoxy resin (A) having a hydroxyl group and/or an epoxy group at the end of a polymer chain, and a polyamide resin (B), and characterized by The ratio of the phenoxy resin (A) is 50 to 90 mass % in the total 100 mass % of the phenoxy resin (A) and the polyamide resin (B), and the The ratio of the polyamide resin (B) is 10% by mass to 50% by mass, and the tensile elastic modulus (M ) with respect to the tensile elastic modulus (Mo) at 23°C, the retention rate of the tensile elastic modulus [the following formula (i)] is 50% or more; formula (i): the retention rate of the tensile elastic modulus (% )=M[tensile modulus of elasticity at 80°C (MPa)]/Mo[tensile modulus of elasticity at 23°C (MPa)]×100. |
| priorityDate | 2018-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 80.