http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113225921-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b8c276ee7b162c2091dba32b779687cc |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-002 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2021-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f1191ef2dac0e67f9552aa85800605a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3850c63cd7dff748e961e207beb5ae7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1a0c4c9d0b263c83f95c134721b6b22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_017e989aa9b889d539405e33b53bf06d |
| publicationDate | 2021-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113225921-A |
| titleOfInvention | How to Make Blind Holes in PCB Boards |
| abstract | The present application relates to a method for making blind holes of a PCB board. The method includes: obtaining a PCB printed circuit board and blind hole aperture parameters of the PCB board, the PCB board comprising: N layers of copper foil, N minus 1 layer of developable resin and M blind holes to be set; wherein, the N layers The copper foil and the N minus 1 layer of developable resin overlap each other, the M blind holes to be set are distributed on both sides of the PCB board, and the two sides of the PCB board are covered with dry film; according to the blind hole aperture parameter, determine the The M to-be-developed areas corresponding to the M blind holes to be set up; the M to-be-developed areas are respectively developed to obtain a first orifice plate; both sides of the first orifice plate are etched to obtain a second orifice plate; Alkaline syrup is sprayed on both sides of the second orifice plate to obtain a PCB board with M blind holes. The solution provided by the present application can simultaneously manufacture and process multiple PCB blind holes at one time, thereby improving the processing efficiency of the PCB blind holes, thereby improving the production efficiency. |
| priorityDate | 2021-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.