http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113224219-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0066 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-483 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| filingDate | 2021-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113224219-B |
| titleOfInvention | Full-color-matching COB light source and manufacturing method thereof |
| abstract | The invention discloses a full-color-mixing COB light source and a manufacturing method thereof, wherein the COB light source comprises a packaging substrate, a COB chip and a die bonding adhesive, when the packaging substrate is prepared, an original die bonding area is creatively set into a plurality of transverse die bonding grooves, a longitudinal die bonding groove and a transverse die bonding groove, the size of the longitudinal die bonding groove is consistent with that of the COB chip to be bonded, a groove is formed in the die bonding groove, the die bonding adhesive can enter the groove after point gluing in the die bonding groove subsequently, the glue overflow condition can be greatly reduced, and the die bonding adhesive is not easy to cover the side edge of the COB chip during bonding, so that the electric leakage condition is avoided. The COB light source light-emitting efficiency of this application preparation is high, and the light-emitting is even, can not cover gluey at the side of preparation in-process COB chip, and solid crystal glue can not appear overflowing gluey condition, and the yield and the reliability of COB light source are high, and luminous effect is excellent, and the practicality is higher. |
| priorityDate | 2021-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.