http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113192663-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-24 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate | 2021-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113192663-B |
| titleOfInvention | A kind of enhanced conductive paste and electronic device |
| abstract | The invention provides an enhanced conductive paste and an electronic device, and relates to the technical field of new materials. The enhanced conductive paste provided by the present invention is composed of the following materials by weight percentage: 4% to 20% resin, 4% to 10% curing agent, 50% to 80% conductive filler, 5% to 35% reinforcing filler, 5% to 25% solvent and 0.05% to 4% additives; the reinforcing fillers include whiskers, linear or fibrous reinforcing structures with a tensile strength above 1GPa, and metals coated outside the reinforcing structures layer, the conductive performance of the metal layer is better than that of the reinforced structure; the length of the reinforced filler is 0.1 μm to 25 μm. The technical scheme of the invention can improve the adhesion between the conductive structure and the base material in the electronic device. |
| priorityDate | 2021-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 58.