| abstract |
The present invention provides a photosensitive resin composition capable of forming a photocured product excellent in thermal shock resistance without impairing each of basic properties such as solder heat resistance, alkali developability, and coating film appearance. The photosensitive resin composition contains (A) a carboxyl group-containing photosensitive resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a reactive diluent, and (E) an epoxy compound, and the (B) The elastomer contains (b) a telechelic polymer. |