http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113166410-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 |
| filingDate | 2019-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4d596d86577182a20542357bc8211e0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5f27808cdbccbc0fc0bc792074374c2 |
| publicationDate | 2021-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113166410-A |
| titleOfInvention | Photosensitive thermosetting resin compositions, dry films and printed circuit boards |
| abstract | To provide: a photosensitive thermosetting resin composition, dry film and printed circuit board which can be developed with a weakly alkaline sodium carbonate aqueous solution and are excellent in photosensitivity, heat resistance, flexibility and other mechanical properties. A photosensitive thermosetting resin composition, comprising: (A) an alkali-soluble polyamideimide resin, (B) a resin having an unsaturated double bond and a carboxyl group, and (C) a thermosetting cyclic ether group-containing The compound, and (D) a photopolymerization initiator, the (A) alkali-soluble polyamideimide resin has a structure represented by the following general formula (1) and a structure represented by the following general formula (2) Polyamideimide resin. (X 1 is a residue of an aliphatic diamine (a) derived from a dimer acid having 24 to 48 carbon atoms, X 2 is a residue of an aromatic diamine (b) having a carboxyl group, and Y is each independently a ring hexane ring or aromatic ring.) |
| priorityDate | 2018-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 148.