http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113165123-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3612 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-40 |
| filingDate | 2020-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113165123-B |
| titleOfInvention | Solder alloys, solder pastes, solder balls, solder preforms and solder joints |
| abstract | The present invention provides a solder alloy, solder paste, solder ball, solder preform, and solder joint using the solder alloy, which is excellent in temperature cycle characteristics and drop impact resistance, and can suppress yellowing and maintain excellent The wettability can further suppress the increase in the viscosity of the solder paste over time. The solder alloy contains, in mass %, Ag: 0.2-1.2%, Cu: 0.6-0.9%, Bi: 1.2-3.0%, In: 0.01-2.0%, Sb: 0.02-1.0%, As: 0.0040-0.025%, remainder The amount consists of Sn. |
| priorityDate | 2019-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 229.