| abstract |
[Objective] To provide a composition capable of forming a low-dielectric cured film excellent in chemical resistance, heat resistance, and resolution. Also provided is a method of manufacture using the composition. [Means] The present invention provides a composition comprising: an alkali-soluble resin, a polysiloxane, a diazonaphthoquinone derivative, a compound that generates an acid or a base when exposed to heat or light, and a solvent, the base The soluble resin is a polymer including a polymerized unit including a carboxyl group and a polymerized unit including an alkoxysilyl group. |