http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113126436-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d6580bdbcebab0189b1f8ab0de6d1116 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate | 2019-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67e9138e5a731253a649f145e63c4e9b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46c053ffdc2a27596998063f2661b679 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11992bdd6845b9225d2cb7eb7c41ee00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38f754b2b34030b38508043aba56004b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e76ea9e7b1b30cd43e856417ee6272e3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_279b677acfba465fba13da9ffc59c404 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69320aa26c39c60fc5b6240e3824746d |
| publicationDate | 2021-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113126436-A |
| titleOfInvention | Laminated cured product, curable resin composition, dry film, and method for producing laminated cured product |
| abstract | The present invention provides a cured product layer having embedment properties, insulation reliability and resolution, and a cured product layer for the cured product, providing a laminate cured product, a curable resin composition, a dry film, and a method for producing the laminated cured product. The curable resin composition of a layer, the dry film formed from this curable resin composition, and the manufacturing method of this hardened|cured material layer. The cured product layer may be, for example, a laminated cured product or the like, which is formed by sequentially laminating (A) a first cured product layer formed of a first curable resin composition on a circuit board, and a negative-type second cured product layer. The laminated cured product of (B) the second cured product layer formed of the flexible resin composition is characterized in that: the thickness of the (A) first cured product layer is thinner than the thickness of the connecting circuit of the circuit board, so The negative-type second curable resin composition contains an inorganic filler and an ultraviolet absorber, the first curable resin composition contains no inorganic filler, or the negative-type second curable resin Lesser amounts of the compositions contain inorganic fillers. |
| priorityDate | 2019-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 423.