http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113113401-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0bb8b1b6b4acc7de6d137f47dd491b22 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-488 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488 |
| filingDate | 2021-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44daed7056ce97108321db3837233bb6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db46fa9e7f5c6ea3661647e162765a2a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e26eb808d4bcfb89e8281f7b0ac706da |
| publicationDate | 2021-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113113401-A |
| titleOfInvention | Semiconductor circuit and method for manufacturing semiconductor circuit |
| abstract | The invention relates to a semiconductor circuit and a manufacturing method of the semiconductor circuit, which comprises a heat dissipation substrate, a circuit wiring layer, a plurality of electronic elements, a plurality of pins, a sealing layer and a protective plate made of metal materials, wherein mounting grooves penetrating through the thickness of the mounting grooves are formed in two ends adjacent to the side edges of the mounting pins of the sealing layer, the protective plate comprises a protective body, the protective body is mounted on the surface of the sealing layer close to a heat dissipation surface, and the sealing layer is formed on the surface of the protective body in an injection molding mode. When passing through mounting groove and notch like the screw through the mounting, its nut is contradicted on the surface of protection body with this to the effect of the protection sealing layer of playing has prevented among the prior art that the nut oppresses the sealing layer and leads to the risk of collapsing the limit, thereby has promoted semiconductor circuit's security and reliability. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114083905-A |
| priorityDate | 2021-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.