| abstract |
In an embodiment, a structure includes: a core substrate; a coupled redistribution structure, the redistribution structure including a plurality of redistribution layers including a dielectric layer and a metallization layer, the redistribution structure Also included is a first local interconnect assembly embedded in a first redistribution layer of the plurality of redistribution layers, the first local interconnect assembly including a conductive connection bonded to the metallization of the first redistribution layer a pattern, the dielectric layer of the first redistribution layer encapsulates the first local interconnect component; a first integrated circuit die coupled to the redistribution structure; a second integrated circuit die coupled to the redistribution structure, the first local The interconnect structure of the interconnect assembly electrically couples the first integrated circuit die to the second integrated circuit die; and a set of conductive connections coupled to the second side of the core substrate. Embodiments of the present application also relate to package structures, packages, and methods of forming the same. |