http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113085430-A

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B19-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B44C3-046
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filingDate 2021-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_754c18855e3e69c34f461a91a28e10bb
publicationDate 2021-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-113085430-A
titleOfInvention A jade spar forming process with large and delicate relief patterns
abstract The invention relates to the technical field of relief processing. Disclosed is a jade spar forming process with a large-scale and delicate embossed pattern, comprising the following steps: step 1: selecting a complete wooden board and raw materials of jade spar; step 2: carving a relief pattern on the wooden board to obtain an original master; Step 3: Reprint the original master silica gel to form a mold to obtain a first silica gel mold; Step 4: Pour the raw material of jade spar into the first silica gel mold, vacuumize and solidify to form a jade spar blank; Step 5: Prepare a jade spar blank The negative side of the spar blank is finely polished to obtain a jade spar master; Step 6: Reprint the jade spar master with silica gel to form a second silicone mold; Step 7: Pour the jade spar raw material into the second silica gel In the mold, vacuum solidification and molding to obtain the finished jade spar. This solution mainly solves the problem that the current relief is difficult to grind due to the narrow concave position of the pattern, which is not conducive to tool penetration and processing, and even damages the overall pattern accidentally.
priorityDate 2021-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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