| abstract |
A method of forming a die stack comprising: bonding a first device die to a second device die; encapsulating the first device die in a first encapsulant; and performing backgrinding on the second device die process to expose through vias in the second device die; and forming a first electrical connector on the second device die to form a package. The package includes a first device die and a second device die. The method also includes encapsulating the first encapsulant in a second encapsulant; and forming an interconnect structure overlapping the first encapsulant and the second encapsulant. The interconnect structure includes a second electrical connector. According to other embodiments of the present application, die stack structures are also provided. |