http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113044802-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c094c8526b300120081f9f27c0ba8f7c |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0264 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00277 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00261 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 |
| filingDate | 2021-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_837ba34202e856a96591152a10105b53 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca477a7ef684f5d2a1a74313f5096cb4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8366080b794b6374a7c8ef651b5def6 |
| publicationDate | 2021-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113044802-A |
| titleOfInvention | MEMS device vacuum packaging structure and manufacturing process thereof |
| abstract | A MEMS device vacuum packaging structure and a manufacturing process thereof are provided, the MEMS device vacuum packaging structure comprises: the sealing cover is provided with a through hole penetrating through the front surface and the back surface of the sealing cover, the wall of the through hole is provided with a first conducting layer, the front surface and the back surface of the sealing cover are respectively provided with a second conducting layer, and the second conducting layers are in electrical contact with the first conducting layers; a silicon substrate; a MEMS structure for outputting an electrical signal; an electrical conductor in electrical contact with the second conductive layer and the MEMS structure, respectively; the transition structure is respectively bonded and connected with the reverse side of the sealing cover and the silicon substrate to form a vacuum sealing space; the packaging structure adopts a mode that the electric connection channel longitudinally penetrates through the sealing cover, and a transition structure is respectively bonded and connected with the reverse side of the sealing cover and the silicon substrate to form a vacuum sealing space, so that the overall size is reduced, the structure is compact and dense, and the packaging between system elements is facilitated. |
| priorityDate | 2021-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.