| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C2222-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2311-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-06 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C70-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C22-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C70-68 |
| filingDate |
2021-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2022-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-113026008-B |
| titleOfInvention |
Composition for forming coating film, method for producing surface-treated metal member, and method for producing metal-resin composite |
| abstract |
The invention provides a composition for forming a coating film with excellent adhesion with resin on a metal surface, and a surface treatment metal member with the coating film formed by using the composition. The composition for forming a coating film is a solution containing an amino group-containing silane coupling agent, a metal ion, and a halide ion. The metal ion is preferably copper ion, and the concentration of copper ion in the solution is preferably 0.1mM to 60 mM. The amount of Si in the solution is preferably 30 or less in terms of a molar ratio to the amount of Cu. The pH of the solution is preferably 2.8 to 6.2. |
| priorityDate |
2020-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |