http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113015343-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 |
| filingDate | 2021-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-113015343-B |
| titleOfInvention | A method for making an interlayer cross-wire connection structure and a circuit board |
| abstract | The invention discloses a manufacturing method and a circuit board of an interlayer cross-wire connection structure. The manufacturing method comprises the following steps: manufacturing a first connecting wire slot and a first circuit connected to each other on a first surface of an insulating base material The groove is made on the second surface of the insulating base material to connect the second connecting wire groove and the second circuit groove. The depth of the first and second connecting wire grooves is ≥ 1/2 of the thickness of the insulating base material. The depth of the second line groove is less than 1/2 of the thickness of the insulating base material; the first and second connecting line grooves are crossed to form a through hole in the overlapping area of the two connecting line grooves; The copper layer on the surface is removed from the board; then a layer of nickel is deposited by immersion nickel, and the surface of the circuit is flattened by grinding to obtain a precision circuit. The invention adopts the method of laser ablating two intersecting wire grooves and forming through holes in the overlapping area of the two intersecting wire grooves, so that the area occupied by the through holes connected between the layers is greatly reduced, and is suitable for the interlayer of the IC carrier board. connect. |
| priorityDate | 2021-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.