http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113013336-A

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filingDate 2021-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b51cee0904ac91d8d28610ab01c4acb1
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publicationDate 2021-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-113013336-A
titleOfInvention A method for encapsulating organic optoelectronic devices based on composite materials
abstract The invention provides a method for encapsulating organic optoelectronic devices based on composite materials, comprising the following preparation steps: 1) preparing an anti-penetration dense layer film on the surface of the prepared organic optoelectronic devices, with a thickness of 2-100 nm; 2) on the above sample A hydrophobic layer film was prepared on the surface with a thickness of 1-20 nm; 3) Steps 1) and 2) were repeated to prepare a multi-composite encapsulation layer, and the number of repetitions was ≥ 1. Compared with the prior art, the present invention has the following beneficial effects: through the encapsulation process in the present invention, the compactness of the metal oxide and the water resistance of the hydrophobic layer are combined, the water and oxygen resistance of the device is greatly improved, and the The storage life of the device in the air; through the encapsulation engineering in the present invention, due to the excellent sealing performance, the degradation reaction products are blocked in the device, so that the reaction cannot continue to occur, effectively preventing the organic optoelectronic device from operating in the working environment (illumination). , heat), which increases the working life of the device.
priorityDate 2021-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 51.