| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aa6e4421d9e1159b6012d9bf702be572 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0317
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0272
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-249
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0112
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0379
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1283 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-037
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1258 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
2019-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28486325cb358473694a56fd0dd34a34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abd5d5322dbd185ff8b1f9d71569fab6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_209ba3d6872f1e7a6d913986d383747d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fc1f307761cb617ccab40505d1d6078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fcd8c9c3914f328a0e7945ed32fb8f68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f876d7c4d20b5a3bcd35b3cfa5fe3048
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb813812c971442e0f6659bf00a6b02f |
| publicationDate |
2021-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-112996869-A |
| titleOfInvention |
Conductive substrate including metal wiring, method for producing the same, and metal ink for forming metal wiring |
| abstract |
The present invention relates to a conductive substrate provided with a base material and a metal wiring composed of at least one of silver or copper. The conductive substrate has an anti-reflection region formed on a part or the entire surface of the metal wiring. The antireflection region is composed of roughened particles, which are formed of at least one of silver or copper, and blackened particles that are finer than the roughened particles buried between the roughened particles. The blackened particles are composed of silver or a silver compound, copper or a copper compound, or carbon or an organic substance having a carbon content of 25% by weight or more. Furthermore, the average roughness of the center line of the surface of the anti-reflection region is 15 nm or more and 70 nm or less. The conductive substrate of the present invention is produced by forming metal wirings with the metal ink forming roughened particles and then applying the blackening ink containing the blackening particles. The metal wiring of the conductive substrate of the present invention suppresses light reflection, and it is difficult to visually confirm the presence of the metal wiring. |
| priorityDate |
2018-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |