http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112969307-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4b46cfd95b7583a08f086761b1374ea7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B32-21 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F265-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F222-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F265-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B32-21 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-06 |
| filingDate | 2021-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc6cbd64aa643b104fdd24666d10d0b1 |
| publicationDate | 2021-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112969307-A |
| titleOfInvention | A kind of preparation method of carbon-based filling material |
| abstract | The invention relates to the technical field of semiconductors, in particular to a method for preparing a carbon-based filling material. The carbon and silicon dioxide are cross-linked and then calcined, and an etching solution is used to remove the silicon dioxide to obtain a carrier; the carrier is etched to obtain a carrier. Etching a through etch hole, depositing a silicon crystal layer on the carrier by a traditional method as a matrix; preparing a filling curable composition, mixing acrylic polymer, acrylic monomer and maleimide; curing Filling the etched hole with the curable composition, drying and drying, curing the curable composition, placing the solder, filling the curable composition again, drying and drying to obtain a filling material layer, the preparation method of the carbon-based filling material provided by the present invention , It can prevent the leakage of the electrode, increase the bonding strength between the circuit board and the chip, prevent the chip from falling off, and has better physical properties and strength. By preparing porous carbon materials, it has a long service life. |
| priorityDate | 2021-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.