http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112961461-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-085 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-06 |
| filingDate | 2021-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112961461-B |
| titleOfInvention | Organic resin composite material with 3D polyimide as heat conducting framework and preparation method thereof |
| abstract | The invention provides an organic resin composite material taking 3D polyimide as a heat conducting framework and a preparation method thereof, belonging to the technical field of nano composite materials. According to the invention, the 3D structure polyimide composite foam capable of loading the heat-conducting filler is firstly prepared, the 3D structure polyimide composite foam has the characteristics of large volume and small density, so that a large amount of space is occupied in limited mass, the heat-conducting filler can be loaded on the 3D structure polyimide composite foam in a large amount, is uniformly distributed and effectively forms a heat-conducting network, and a heat-conducting passage can be preferentially formed even if the content of the heat-conducting filler is low. Moreover, the polyimide composite foam forms a dendritic network structure, which is beneficial to the distribution of the heat-conducting filler in a specific space, and the heat-conducting filler is tightly connected with the heat-conducting filler, so that the whole material can meet the requirement of improving the overall heat-conducting performance of the heat-conducting filler at low content when the composite material is prepared, and the development and application of the composite material in the fields of microelectronics, electronic components and the like can be widened accordingly. |
| priorityDate | 2021-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 76.