http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112960163-B

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65B5-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65B43-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65B43-465
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65B51-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65B43-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65B43-54
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65B51-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65B43-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65B43-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65B5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65B43-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65B43-54
filingDate 2021-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2022-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-112960163-B
titleOfInvention A large-scale integrated circuit chip high-efficiency packaging equipment and packaging method
abstract The invention provides a large-scale integrated circuit chip high-efficiency packaging equipment and packaging method, which relate to the technical field of circuit chip production and packaging, including a workbench, the left side of the top of the workbench is fixed with a left support frame, and the top of the workbench is fixed on the left. The side is fixed with a right support frame, the left support frame is set as an L-shaped plate structure, the right support frame is set as an L-shaped plate structure, and the top surface of the left support frame is equal to the top surface of the right support frame. There is a gap between the left support frame and the right support frame; through the cooperation of the second electric push rod and the second servo motor in the present invention, one of the packaging bags can be taken out from the material taking port downwards, and the taken out The packaging bag extends into the position of the first suction cup, and the top of the packaging bag is opened through the cooperation of the first suction pump and the second suction pump, so that the feeding nozzle can quickly and accurately inject large-scale circuit chips into the packaging bag , improve delivery efficiency, and improve delivery accuracy.
priorityDate 2021-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491185
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23925

Total number of triples: 24.