| abstract |
Embodiments of the present disclosure relate to a method for manufacturing an electronic chip. A method for manufacturing an electronic chip, comprising: forming trenches laterally separating the integrated circuits on a top surface side of a semiconductor substrate in and on which a plurality of integrated circuits have been formed; at least one metal connection post is deposited per integrated circuit on the top surface side of the substrate, and a protective resin is deposited in the trench and extending over the top surface of the integrated circuit. The method also includes forming an opening from a top surface of the protective resin positioned across the trench, and the opening extending over a width greater than or equal to a width of the trench so as to clear a flank of the at least one metal pillar of each integrated circuit. The integrated circuit is separated into individual chips by dicing. |