| abstract |
Embodiments of the present disclosure relate to methods for fabricating electronic chips. A method for manufacturing an electronic chip includes depositing a protective resin on an upper surface side of a semiconductor substrate in and on which a plurality of integrated circuits have been formed. The method includes forming, for each integrated circuit, at least one cavity in the protective resin in contact with an upper surface of the integrated circuit. Metal connection posts are formed by filling the cavity with metal. The integrated circuits are separated into individual chips by cutting the protective resin along dicing lines extending between the metal connection posts. |