| abstract |
The invention discloses a manufacturing method of a 25Gbs high-speed modulation DFB laser chip, which is characterized by comprising the following steps: chip design: designing a DFB laser chip is performed by a plurality of teams; and (3) round crystal production: firstly, photoetching is carried out, then the round crystal is processed, so that the round crystal can reach the specification, the preliminary processing of the round crystal is completed, and the round crystal detection is as follows: the invention preferentially designs the DFB laser in the directions of accuracy, bandwidth and the like, so that the device can calibrate the laser position compared with the traditional device, and the chip can control the laser to cut other objects with high precision. |