| abstract |
The present invention relates to the field of photosensitive technology, in particular to a photosensitive resin composition and its application. The photosensitive resin composition provided by the present invention comprises: a resin containing the structure shown in formula I, a phenolic hydroxyl compound and a photosensitizer; wherein, M has the structure shown in formula II; R 1 , R 2 and R 3 are independently selected from C2 Divalent to hexavalent organic groups of ~C20; R 4 and R 5 are independently selected from hydrogen, alkali metal ions, ammonium ions or organic groups containing 1 to 20 carbon atoms; o is selected from integers from 3 to 100000 n and m are independently selected from integers from 0 to 2; p is selected from integers from 0 to 8, q is selected from integers from 0 to 4, and p+q>0. By using the photosensitive resin composition of the present invention, sheets and cured films with better light transmittance can be obtained. |