| abstract |
A resin composition for three-dimensional printing at elevated temperature forming a high temperature resistant material, the resin composition comprising a thermally curable component A and a photocurable component B, the component A having an optional One or more chemical species from monomers and/or oligomers and/or prepolymers of maleimide derivatives according to formula, said component B having one or more selected from Chemicals: (meth)acrylates, (meth)acrylamides, vinyl esters, vinyl ethers, vinyl, allyl, alkynyl or styrene compounds, and those selected from among them from component A At least one molecularly substituted derivative of group, wherein the amount of component A is in the range of 30% to 95% by weight, based on the combined weight of components A and B, and the amount of said photocurable component B is in the range of In the range of 5-70% by weight, based on the total weight of components A and B. (I). |