http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112795962-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-00 |
| filingDate | 2020-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112795962-B |
| titleOfInvention | Leveling agent, electroplating solution and its application |
| abstract | The invention relates to a leveling agent, an electroplating solution and applications thereof, wherein the leveling agent comprises functional components, and the functional components are reaction products of primary amine compounds containing ether bonds, secondary amine compounds and diepoxy compounds. When the leveling agent is used in the copper electroplating solution, within the conventional current density range, it can not only ensure that the blind hole filling and plating meet the conventional requirements, but also control the surface copper thickness within a small range. It can not only improve production efficiency, but also reduce process cost, and has excellent compatibility with the production of fine lines, reducing the etching difficulty of subsequent production of fine lines. |
| priorityDate | 2020-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 130.