http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112778964-B

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J177-00
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J177-00
filingDate 2021-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2022-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-112778964-B
titleOfInvention Hot-melt adhesive, preparation method thereof, and wire head insulation method
abstract The application discloses a hot-melt adhesive, a preparation method thereof, and a wire head insulation method. The hot-melt adhesive comprises aliphatic polyamide, polyethylene wax, antioxidant, maleic anhydride grafted polyolefin and polyvinyl alcohol. become. The hot melt adhesive has suitable bonding strength with the surface of copper wire and solder, which can ensure that the wire head will not fall off during transportation and vibration after insulation, and at the same time, it can be easily peeled off without residue during the welding process of the wire head, so it will not affect In addition, the hot melt adhesive is more environmentally friendly, has high insulation performance and reliability, and has no adverse effects on the wire head and the electronic product to which the wire head is welded.
priorityDate 2021-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID961
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID16386
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID421282573
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID22061879
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID164648
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419557064
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5352426
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID31250
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID413959477
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426252242
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415860002
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419524915
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID22440003
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458396225
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419579088

Total number of triples: 34.