| abstract |
The invention provides a copper foil, a characterization method thereof and a copper-clad plate, wherein the characterization method for verifying whether the copper foil can penetrate through copper or not comprises the following steps: (1) preparing a copper foil and testing the burst index of the copper foil by adopting a rupture strength testing machine; (2) if the burst index of the copper foil is more than or equal to 3.0KPa.m 2 And/g, the copper is not penetrated and is characterized as qualified, and the copper is penetrated and is characterized as unqualified. Wherein the copper foil has a thickness of 18 μm or less and a burst index of 3.0KPa.m 2 More than g. The inventor of the present invention found in the study that the thickness is 18 μm or less and the burst index is 3.0KPa.m 2 The copper foil above the/g can be used for manufacturing a copper-clad plate, and the copper penetration defect is avoided. |