http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112694838-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_62289c2107ed903db77aa8f7f33b81e3 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-488 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J1-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J1-00 |
| filingDate | 2020-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eee67513df8565bbc4e515e125915558 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d343f2e5ebc50f0141d2a9d99ff8970e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd214768ca74f8f771cc8b96c67ca062 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2aab39467a5bd3bca20b5975ad34f1cd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_600d2966a1463ecddfd8ba38d8730eac |
| publicationDate | 2021-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112694838-A |
| titleOfInvention | A new type of precious metal binder for bonding semiconductor components |
| abstract | The invention discloses a novel precious metal binder for combining semiconductor elements, belonging to the technical field of semiconductor electronics. It is composed of noble metal powder and organic solvent, wherein the volume content of noble metal powder is 26%-66%, and the balance is organic solvent. The noble metal binder in the present invention does not contain various resins that may contaminate the bonding member, so that the generation of voids can be suppressed due to the uniform development of organic components during heat bonding. In the process of use, it can be evenly coated on the joint part, and the structural parts are well wetted, and the noble metal powder is evenly dispersed in the solvent, so as to avoid pollution at the joint of semiconductor electronic components, and after the joint part is heated, the precious metal is in a good sintering state. |
| priorityDate | 2020-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 113.