Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_154f5a8a983d88f296117dcc92946ab4 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-12 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F3-04 |
filingDate |
2020-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50b1ec6e60723524048b6f90975491ed http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b010d45046e0860d47ebbf7043340a2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f835a4abf6b44a3ead65113149778153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a8bff1c45385053f16390cb234e787a |
publicationDate |
2021-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-112680109-A |
titleOfInvention |
CMP slurry composition for polishing copper film and method for polishing copper film therewith |
abstract |
The present invention relates to a chemical mechanical polishing slurry composition for copper films and a method for polishing copper films using the same. The chemical mechanical polishing slurry composition includes: at least one solvent selected from polar solvents and non-polar solvents; and silane-modified polishing particles, wherein the silane is represented by Formula 1. |
priorityDate |
2019-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |