http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112658529-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-362 |
| filingDate | 2020-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112658529-B |
| titleOfInvention | A kind of solder paste and its application |
| abstract | The invention relates to the technical field of device welding, and specifically discloses a soldering paste, which includes flake nano-silver, a metal-organic source and an organic solvent carrier. The present invention also discloses the application of the above-mentioned solder paste in the packaging and interconnection structure of electronic devices. The packaging and interconnection structure of electronic devices includes a first mother sheet, a second mother sheet and a The connecting layer is formed by sintering the solder paste through a sintering process of heating and applying pressure. In the sintering process, the heating temperature is 130° C. to 300° C. and the pressing pressure is 1 MPa to 20 MPa. The invention can be well applied to the field of electronic packaging for low-temperature welding and high-temperature service. The connection interface of the connection layer formed by sintering the solder paste has a good bonding degree and is uniform and compact, and the shear strength can reach more than 51 MPa at 150° C., which has the advantages of High shear strength, can be well applied to packaging interconnection of electronic devices. |
| priorityDate | 2020-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 80.