| abstract |
The invention discloses a resin composition comprising vinyl polyphenylene ether resin and multifunctional vinyl silane. The aforementioned resin composition can be made into a prepreg, a resin film, a laminate or a printed circuit board, and the surface appearance of the prepreg or substrate, glass transition temperature, thermal expansion rate, peel strength, heat resistance after moisture absorption, heat resistance, dielectric At least one of properties such as constant, dielectric loss, and glue flow in the board is improved. |