| abstract |
The invention relates to the technical field of adhesives, in particular to an electronic adhesive and a preparation method thereof, wherein the electronic adhesive comprises the following steps: step S10, preparing the composite filler: adding a hydroxylated boron nitride nanosheet and a hydroxylated aramid nanofiber into a gamma- (2, 3-epoxypropoxy) propyl trimethoxy silane aqueous solution with the pH value of 5-6, reacting to obtain a modified boron nitride nanosheet and a modified aramid nanofiber with organic groups on the surfaces, and cleaning and drying to obtain a composite filler; step S20, preparing a polyurethane adhesive matrix by adopting a two-stage reaction; step S30, obtaining polyurethane emulsion through primary emulsification; and step S40, carrying out secondary emulsification to obtain the adhesive. The adhesive provided by the invention has good thermal conductivity, insulativity, dispersion stability, flexibility and temperature sensitivity, and is suitable for adhesion and disassembly and assembly of electronic components. |