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filingDate 2019-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2021-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-112584611-A
titleOfInvention Component carrier with vias extending through multiple dielectric layers
abstract A component carrier (100) and method of making the component carrier are provided. The component carrier comprises: a stack (102) having a front side (104) and a back side (106) and comprising a plurality of stacked electrically insulating layer structures (108); through holes (110) in Its inner portion (185) is narrower than at its outer portions (187, 189) and extends through the plurality of electrically insulating layer structures (108) such that the sidewalls ( 154) Defining respective portions of the vias (110); and a conductive fill medium (112) filling at least a portion of the vias (110).
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priorityDate 2019-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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